Target Bonding - Metallic & Silver Filled Epoxy
Typically, target bonding is done using an Indium-based alloy which enables convenient removal of spent targets for backing plate re-use. Certain types of materials require a silver filled epoxy, which is used to adhere the target material to the backing plate. In either case, a protective barrier layer is deposited onto the bond side of the material. This process increases adhesion characteristics, thermal properties, and prevents solder diffusion.

Metallic bonded target ready
for QC and final cleanup