Target Bonding

Target bonding with our in-house e-beam evaporator.

Metallic bonded target ready for QC and final cleanup.

Target Bonding - Metallic & Silver Filled Epoxy

Typically, target bonding is done using an Indium-based alloy which enables convenient removal of spent targets for backing plate re-use. Certain types of materials require a silver filled epoxy, which is used to adhere the target material to the backing plate. In either case, a protective barrier layer is deposited onto the bond side of the material. This process increases adhesion characteristics, thermal properties, and prevents solder diffusion.