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  • Sputtering Targets and
    Evaporation Materials
  • Target Bonding
  • Backing Plates
  • Fabrication and
    Quality Control
  • General Materials List
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  • 944 System
  • ELAS System
  • R&D System
  • Asher System
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Target Bonding

Target Bonding - Metallic & Silver Filled Epoxy

Typically, target bonding is done using an Indium-based alloy which enables convenient removal of spent targets for backing plate re-use. Certain types of materials require a silver filled epoxy, which is used to adhere the target material to the backing plate. In either case, a protective barrier layer is deposited onto the bond side of the material. This process increases adhesion characteristics, thermal properties, and prevents solder diffusion.