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Systems

944 System

ELAS System

R&D System

Asher System

Materials

Sputtering Targets and
Evaporation Materials

Target Bonding

Backing Plates

Fabrication and Quality
Control

General Materials List

 

 

ELAS System

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Cassette to Cassette operation for 4”, 6” and 8” wafers. Using industry standard Brooks robot system.

Features

  • ESC Large Area Sputter
  • Dual level load lock
  • CTI 10” cryo pump on chamber as standard
  • CTI 8” cryo, turbo pump or rotary pump available on load lock
  • 3 Target plus RF etch station as standard
  • Dual level load lock
  • Through wall mounting for very small cleanroom footprint
  • Large area substrate
  • Up to 400mm X 420mm
  • 4 200mm WAFERS
  • 6 150mm WAFERS

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