Materials
Sputtering Targets and
Evaporation Materials
Target Bonding
Backing Plates
Fabrication and Quality
Control
General Materials List
Systems
944 System
ELAS System
R&D System
Asher System
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R & D System
System can be configured to meet customers individual requirements. If it requires a vacuum and a plasma ESC will help you configure a system.
Features
- Load lock system.
- Multi target system.
- Co sput of up to three materials (RF or DC) plus substrate bias.
- RF Etch station in load lock.
- 8” substrates.
- Full recipe control.
Contact us today!
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